Shahriar (Sha) Rabii

Despite the rise of GPUs and custom ASICs, Saban emphasized that the core value of FPGAs remains: flexibility, time-to-market, and adaptability. 40 Years of FPGA: From Logic Cleanup to AI Acceleration https://lnkd.in/dbRh-cB3

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Intel’s advanced packaging is world class and a national treasure chest hiding in plain sight. While TSMC dominates today in manufacturing scale with CoWoS, Intel’s EMIB and Foveros technologies are more advanced by design. EMIB delivers ultra-low latency die-to-die connections without the cost and yield penalties of large silicon interposers. Foveros enables true 3D stacking, unlocking new levels of performance, density, and power efficiency that CoWoS simply can’t match. As we enter the era of heterogeneous integration and chiplet-based architectures, Intel has the technology to leapfrog rivals. Intel holds the keys to the future of high-performance computing, AI acceleration, and secure domestic supply chains. Intel's packaging technologies embody the very foresight Gordon Moore envisioned 60 years ago. Intel packaging isn’t just good, it’s the differentiator the U.S. cannot afford to overlook. #Semiconductors #AdvancedPackaging #Intel #Innovation #SupplyChain

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Up next at ASP-DAC 2025 was research on Optical Networks-on-Chip (ONoCs).   Wavelength-Routed Optical Networks-on-Chip (WRONoCs) are revolutionizing on-chip communication with their ability to provide high-speed, low-power data transfer, making them a promising solution for high-performance computing systems. However, ensuring reliable signal transmission in the presence of thermal and process variations remains a key challenge.   Zhidan Zheng presented our paper “A Backup Resource Customization and Allocation Method for Wavelength-Routed Optical Networks-on-Chip Topologies”. Her innovative approach tackles variations with a dynamic resource allocation approach, customizing backup paths based on the specific failure probabilities of each signal. By accurately modeling the microring resonator (MRR) faults as Gaussian distributions, we identify the reliability requirements and optimize resource usage, significantly enhancing reliability while minimizing power consumption.   This solution not only improves the overall performance of WRONoCs but also sets the stage for more efficient and scalable fault-tolerant systems. This research nicely enhances TUM’s long-standing ONoC research, coordinated superbly by Tsun-Ming Tseng. We’re excited to see how this work will further enhance the future of energy-efficient and reliable communication in next-generation chip designs!   Browse the paper here: https://lnkd.in/dESsF8UG #ASPDAC2025 #EDA #ONoCs #DesignAutomation #ResearchInnovation #TUM Zhidan Zheng, You-Jen Chang, Liaoyuan Cheng, Tsun-Ming Tseng

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Today at AI Infra Connect, our founder and CEO, Nicholas Harris will deliver a keynote talk. He will present a vision for 3D photonics, explaining how this technology is solving the limits of traditional hashtag #semiconductor scaling and copper connectivity. He will reveal how our Passage platform, the world's first 3D co-packaged optics solution, enables a new edgeless I/O design paradigm to deliver massive bandwidth and unprecedented energy efficiency. Join us to learn how this technology is transforming how XPUs and switches are interconnected and driving a new era of AI supercomputing.

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Proudly announcing our recent paper by Omkar Bhalerao on plasmonic refractive index sensors, puiblished in Optics Express The study presents a high-sensitivity bimodal plasmonic refractive index sensor using an aluminum stripe embedded in a bilayer SU-8 polymer waveguide, cladded with a novel polymer. The sensor achieves a record sensitivity of up to 6108 nm/RIU and a detection limit of 1.6×10⁻⁷ RIU, making it a cost-effective technology suitable for integrating photonic and microfluidic systems. Omkar Bhalerao, Stephan Suckow, Horst Windgassen, Harry Biller, Konstantinos Fotiadis, Stelios Simos, Evangelia Chatzianagnostou, Dimosthenis Spasopoulos, Pratyusha Das, Laurent Markey, Jean-Claude Weeber, Nikos Pleros, Matthias Schirmer, Max C. Lemme, 33(5), 9813-9824, Optics Express, 2025. Download the Open Access pdf here: https://lnkd.in/e7X-SYrV

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the Intel Corporation Israel has started major layoffs, hitting Kiryat Gat—despite a $3.2B grant in 2023—as it falls behind industry leaders moving from 7nm/10nm to 3nm/5nm. For the first time, the Kiryat Gat plant is seeing layoffs. Previously spared from cuts, the facility is now part of Intel’s broader cost-cutting moves. Several hundred workers are expected to be affected. Earlier layoffs focused mainly on research divisions in Haifa and Petah Tikva. Intel also shut down local initiatives like Intel Ignite and Granulate, a startup it had acquired in 2022. These moves highlight a shift away from innovation investments. Kiryat Gat received major government support over the years, including a $3.2 billion grant in 2023. In return, Intel expanded operations there. But the site now lags behind in chipmaking tech, still using 7nm and 10nm processes as the industry moves to 3nm and 5nm. For a deeper understanding of the latest semiconductor technologies, read my new book, Semiconductor For All. Get your copy now on Amazon Kindle! https://lnkd.in/gzVV2fJm , For more updates and insights on AI and semiconductor, check out my blog, https://lnkd.in/gUmGrQh4 , To explore how chips shape our world and industries, subscribe my YouTube channel, https://lnkd.in/gdksSJG2 #semiconductor #ai #chips #manufacturing #semiconductorforall

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In his second talk at the Embedded Vision Summit, Naitik Nakrani, PhD Nakrani, Solution Architect Manager at eInfochips (An Arrow Company), will share results from experiments evaluating an approach for aligning images from an RGB camera with depth maps from a time-of-flight (ToF) depth camera, and highlight lessons learned. For session details visit:  https://lnkd.in/gMV9a3Q7 

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EPOXY-FREE CONNECTION WITH PHOTONECT- Revolutionize how you send light to chips. OFC Conference 2025 was the place to discover innovative startups. My colleague Jon Pugh spoke with Juniyali Nauriyal co-founder and CEO of Optica Corporate member Photonect Interconnect Solutions. She heads this startup based in Rochester, NY. Their team is redefining how optical fibers are connected to photonic chips through its patented PIx-Attach technology. This innovative approach eliminates the need for traditional adhesives, fixtures, and mechanical polishing, offering a faster, more reliable, and cost-effective solution for fiber-to-chip attachment. Watch the interview to understand their journey and why it led to starting a company. What Sets Photonect Interconnect Solutions Apart Traditional fiber attachment methods often rely on epoxies and precise mechanical alignment, which can be time-consuming and unpredictable. Photonect's PIx-Attach system utilizes laser-based surface activation to achieve permanent fiber-to-chip connections without adhesives or fixtures. This method not only accelerates the assembly process but also enhances the connection's durability and performance. Key Advantages Speed: The PIx-Attach process is up to 10 times faster than conventional methods, significantly reducing manufacturing time. Efficiency: By eliminating the need for epoxies and mechanical fixtures, the process simplifies the assembly line, leading to up to 50% cost savings. Performance: The technology achieves insertion losses of less than 1 dB, ensuring high-quality signal transmission. Applications and Impact Photonect's technology is particularly beneficial for industries requiring high-volume photonic device manufacturing, such as telecommunications, data centers, and medical devices. By streamlining the fiber attachment process, PIx-Attach enables scalable production while maintaining high performance standards. To learn more about the PIx-Attach system and join the waiting list for updates, visit photonectcorp.com. Please tell them that Optica sent you.

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