
Advanced Circuit Design Engineer
Greater New York City Area

Advanced Circuit Design Engineer
Greater New York City Area
(Public Company; IBM; Information Technology and Services industry)
May 2009 — Present (7 months)
Analog Performance Benchmarking
Product Process Interaction
(Public Company; IBM; Information Technology and Services industry)
May 2005 — August 2005 (4 months)
1. Fabricated van der Pauw, Hall Bar and TLM structures to characterize carrier mobility and density.
2. Characterized the effects of Laser Spike Annealing (LSA) on the carrier properties of –doped polysilicon.
3. Investigated LSA-induced enhancements of key performance figures of merit for 200GHz SiGe HBTs.
(Public Company; IBM; Information Technology and Services industry)
May 2003 — August 2003 (4 months)
1. Developed a soft mask process using Bosch and cryogenic temperature processes for deep Si etch.
2. Optimized Bosch process for reduced scalloping, increased etch rate, and critical dimension control.
3. Explored the feasibility of alternate passivation mechanisms for Bosch etch process.
2001 — 2009