
Director, Procurement Engineering, Total Cost Management, Global Procurement at Flextronics
China

Director, Procurement Engineering, Total Cost Management, Global Procurement at Flextronics
China
Close to 15 years’ experience in the electronics (OEM, CEM/EMS, ODM) manufacturing/chemicals industry in Singapore & China, among which over 11 years were in various managerial positions.
Experienced in sourcing activities for cost reduction through supply localization, value engineering and supplier development program;
In-depth knowledge on chemicals for electronic applications; advanced printed circuit board (PCB) manufacturing and assembly/packaging technology; other electronic components (actives, passives, connectors, etc).
My goals are to gain even greater exposure & experience in managing cross-cultural diversities, and to strike a delicate balance between my technical and business aspirations to reach a newer height.
My philosophy: "To Be Or Not To Be, That's The Question...事在人为"
My motto: "The Best Is Yet To Be... 没有最好, 只有更好!"
Values that I care:
Leadership 领导能力
Efficiency & Effectiveness 效率/效益
Enthusiasm 热忱
Broadband 宽频
Attitude 态度
Best-in-Class 追求顶级
Humility 谦逊
Urgency 紧急意识
Initiative 自发性
• Technical Program Management
• Analytical Lab
• R&D
• MPCpS (Machine/Process Capability Study) Methodology
• Quality Management
• Environmental Compliance (RoHS/WEEE/EuP), Lead-Free
• Lean Six Sigma
• Sales & Marketing
• Process Engineering
• Component/Procurement Engineering
• Value Analysis/Value Engineering (VA/VE)
• Commodity Coding
• Spend Data Management (SDM)
• Alternate/Second Sourcing
• Supplier Development Process (SDP)
• Total Cost Management (TCM)
(Public Company; 10,001 or more employees; FLEX; Electrical/Electronic Manufacturing industry)
October 2008 — Present (1 month)
• Establish and ensure implementation of standard global process, procedures and tools for the management of Flextronics’ costs.
• Implement the RFQ and TCO process with the GCM and Business Segment teams and collaborate with these teams to maximize cost reduction.
• Cost Reduction – Work with GCM teams and business segments to maximize total cost reduction.
- Drive more effective negotiations with suppliers.
- Assure business segments key parts and customer issues are addressed.
- Understand total cost including payment terms, incoterms, transportation costs, and supply chain programs.
- Drive alternate sourcing efforts.
• GCM/Business Segment Collaboration – Work to assure both groups have the information they need to work effectively, and define requirements to address any unmet needs.
- Coordinate the negotiations interlock process.
- Assure negotiations schedules are maintained accurately.
- Drive implementation of the procurement plan from negotiations results.
(Public Company; 10,001 or more employees; FLEX; Electrical/Electronic Manufacturing industry)
January 2008 — September 2008 (9 months)
- Identify opportunities for redesign or component substitution to provide cost reduction or quality improvement.
- Assist GCM & SSCM in identifying opportunities to source with Flextronics strategic suppliers during & after the customer design process.
- Provide technical back-up for alternate sourcing recommendations, such as identifying relevant spec differences, and providing the interface with the customer’s design team.
- Assign commodity codes and classify spend data to improve spend visibility & leverage for GCM to negotiate with suppliers.
- Help maximize the purchasing power through component consolidation, where possible.
- Provide technical support to Flextronics segments as needed to resolve manufacturing problems related to component performance, or customer AVL issues.
- Gather and evaluate supplier road maps together with commodity managers.
(Public Company; 10,001 or more employees; FLEX; Electrical/Electronic Manufacturing industry)
April 2006 — December 2007 (1 year 9 months)
• Responsible for global component engineering under Sourcing, Global Procurement, to support Flextronics design centres on ODM projects.
• Standardize corporate AVL/AML management control and approval process (through centralized component database) to promote design re-use.
• Mitigate risks associated with supply chain, technology, quality & reliability and environmental compliance (RoHS/WEEE/EuP/etc.) through preferred supplier ranking system.
• Define component reliability requirements & specifications for different product applications & market segments
• Early engagement in Value Analysis/Value Engineering activities with design centers for identifying cost reduction opportunities
• Technical audit on supplier qualification & development activities with Global Commodity Management team.
• Develop suppliers of tomorrow that can offer speed, cost, technology and quality to ODM business through global SDP (Supplier Development Process)
(Public Company; 10,001 or more employees; FLEX; Electrical/Electronic Manufacturing industry)
April 2005 — March 2006 (1 year)
• Regional component engineering & RoHS North Asia lead in China, covering Flextronic manufacturing sites at Doumen (Zhuhai), Xixiang (Shenzhen), Dongguan, Shanghai, Changzhou, Nanjing, etc., and design centres at Guangzhou, Shanghai, Shenzhen, etc.
(Public Company; 10,001 or more employees; FLEX; Electrical/Electronic Manufacturing industry)
June 2004 — March 2005 (10 months)
• Flextronics Doumen campus component engineering lead
• Flextronics Doumen campus RoHS implementation champion
(Public Company; 1001-5000 employees; Electrical/Electronic Manufacturing industry)
August 2001 — May 2004 (2 years 10 months)
• Responsible for driving yield improvement activities, reducing customer returns & building total customer satisfaction
• Responsible for implementing company wide quality system, internal audit & work closely with customers for plant visits/audits
• Worked closely with customers (both CEMs & OEMs such as Flextronics, Solectron, Celestica, Jabil, Venture, Motorola, HP, IBM, Dell, Cisco, Lucent, NEC, etc.) in resolving technical or quality issues.
• Responsible for yield improvement, cycle time reduction, cost reduction & process troubleshooting, process/capability improvement, new process/ product introduction, capital budgeting & capacity planning.
• Implemented new processes (such as reverse pulse copper plating, liquid photoimaging technology, etc.) into mass production for capability improvement & cost reduction efforts
• Researched new projects in alignment with corporate roadmap & new capabilities
(Public Company; 1001-5000 employees; Chemicals industry)
July 1998 — June 2001 (3 years)
• Sales and technical support to regional PCB customer base.
• Responsible for new technology transfer, and working closely with customers, suppliers and scientific organizations.
• Responsible for customer service and internal QA laboratory.
• Regional technical support, including new technology transfer.
• Responsible for customer service and internal QA laboratory.
• Responsible for both internal & external technical training or presentation
(Public Company; 10,001 or more employees; MOT; Electrical/Electronic Manufacturing industry)
May 1994 — June 1998 (4 years 2 months)
• Managed and led technical programs in developing advanced BGA substrates; including design, manufacturability, and capabilities.
• Worked closely with customers, suppliers, and scientific organizations worldwide in developing new BGA substrate technologies.
• Responsible for new substrate and PCB process technology development and qualification.
• Responsible for failure analysis in solving process issues.
• Start-up of several production lines for new PCB facility.
• Provide engineering leadership and support to manufacturing operations so as to achieve operational objectives of quality, cycle time, and productivity.
MSc, Management of Technology, 1999 — 2001
Major in:
- Management of Technology
- Management of Research & Development
- Negotiation & Coonflict Resolution Skills
- Accounting
- People & Organization
- Quality Management
- Operations Management
- Managing Technical Professionals
- Business Management (ASEAN Business)
- Managerial Economics
MSc, Industrial & Systems Engineering, 1997 — 1999
Major in:
- Systems Approach to Project Management
- Cost Analysis & Engineering Economy
- Engineering Probability & Simulation
- Statistical Quality Control
- Advanced Engineering Statistics
- Operations Planning & Control
- Decision Analysis
- New Product Management
- Material Flow Systems
- Quality Planning & Management
BEng, Chemical Engineering, 1990 — 1994
Major in:
- Mathematics
- Computing
- Graphics
- Economics
- Engineering I & II
- General & Physical Chemistry
- Engineering Materials
- Chemical Engineering Thermodynamics
- Fluid Mechanics
- Heat & Mass Transfer
- Organic Chemistry & Biochemistry
- Chemical Engineering Principles
- Strength of Materials
- Financial Accounting
- Applied Mathematics
- Reactor Systems I & II
- Process Instrumentation & Control
- Solid & Fluid-Solid Systems
- Separation Processes I & II
- Process Heat Transfer/Materials of Construction
- Sociology
- Process Dynamics & Control
- Industrial Systems & Plant Safety
- Petroleum Refining
- Process Systems Engineering
- Distributed Process Control System
- Pretrochemicals & Processing Technology
- Management & Law
GCE "A" Level, Biology, Chemistry, Physics, Maths, 1988 — 1989
GCE "O" Level, Science, 1984 — 1987
Best Award in Chinese subject - 1986, 1987
First runner-up in nation-wide Chinese essay competition (Senior Citizen Week) - 1987
Primary 6, 1978 — 1983
Class Monitor and Head Prefect (1983)
Maths competition district and overall champion in Sarawak (1983)
Chinese martial arts, yoga, hiking/camping, roller-blading, swimming, net-surfing, reading, music, travel
Member of following professional bodies:
• Institute of Supply Management (ISM), Hong Kong
• Supply Chain ASIA
• PRD (Pearl River Delata) SCM Club, South China
• IMAPS International Microelectronics and Packaging Society
• Surface Mount Technology Association (SMTA)
• American Electroplaters and Surface Finishers Society (AESF)
• The Institution of Chemical Engineers (IChem)
• Singapore Surface Finishing Society (SSFS)
• IPC – Association Connecting Electronics Industries
Adviser, company outdoor adventure club (2003~2004);
Chairman, company outdoor adventure club (2006~now)