Peter C Salmon

Current

• Vice President at Salmon Technologies, LLC; Salmon Patent Portfolio
• Owner at Peter C. Salmon, LLC; Intellectual Property Expert

Past

• CTO at The Salmon Group

Education

• Northeastern University
• Northeastern University
• University of Auckland

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Recommended

3 people have recommended Peter C

Connections

52 connections

Industry

Semiconductors

Websites

• Peter C Salmon, LLC
• IEEE CNSV

Peter C Salmon’s Summary

Peter is an expert in semiconductor packaging with over 30 patents ranging from new flip chip connectors, to new cooling methods, to new assembly and test methods including solder-free, and next generation packaging for servers, routers, and high power systems.

Peter is also an experienced systems engineer for both commercial and defense systems, and he has developed a method for creating highly regarded patent landscape analyses.

Peter C Salmon’s Specialties:

flip chip, solder-free, assembly, automation, wafer level, copper, substrates, cooling channels, electrostatics, roll-up display, semiconductors, LCD, systems engineering, system level functional test, solar cleaning devices, printing press, voltage traveling wave, variable printing, toner, reconnaissance, expert consultant, litigation, reports, disassembly, semiconductor, cooling, 3D, integrated circuits, stacked die, buckled pillars, claim charts, analysis,

Peter C Salmon’s Experience

• Vice President

  Salmon Technologies, LLC; Salmon Patent Portfolio

  (Electrical/Electronic Manufacturing industry)

  July 2007 — Present (2 years 1 month)

  Salmon Technologies has developed a broad portfolio of patents relating to 3D electronic packaging, including synergistic new solutions to structure (reworkable flip chip configurations), cooling (especially liquid cooling) and testing (especially parallel testing).

• Owner

  Peter C. Salmon, LLC; Intellectual Property Expert

  (Semiconductors industry)

  February 2006 — Present (3 years 6 months)

  Peter provides consulting and expert witness services under this LLC. His focus is on Electrical Engineering, Semiconductor Packaging, and Systems Engineering. As a systems engineer and inventor he has a broad technical background and broad experience in patent matters, including patent writing, expert witness, expert reports, claim charts, depositions, and infringement analysis of existing products.

• CTO

  The Salmon Group

  (Printing industry)

  June 1997 — June 2002 (5 years 1 month)

  Peter led a small group of systems engineers and talented consultants to develop a new form of printing called solid state printing, using dry toners and electrostatic imaging. This printing method requires no optics in the form of laser beams or photo conductive drums; rather the image is written by direct manipulation of the toner particles. The method worked dramatically well, but the company stumbled with regard to transferring the image to a drum or belt. Peter has written a new patent to overcome this problem.

Peter C Salmon’s Education

• Northeastern University

  EE , Device Physics, Materials Science , 1969 — 1971

• Northeastern University

  MSEE , Electrical Engineering , 1967 — 1970

• University of Auckland

  BE , Electrical Engineering , 1963 — 1966

Additional Information

Peter C Salmon’s Websites:

• Peter C Salmon, LLC
• IEEE CNSV

Peter C Salmon’s Interests:

Inventions, systems engineering, electronic packaging, servers and data centers, electrostatic motors and generators, photography, hiking

Peter C Salmon’s Honors:

Best of Conference Award, for paper delivered to the 2nd International Wafer Level Packaging Conference, San Jose, California, November, 2005.

Peter C Salmon’s Contact Settings

Interested In:

• career opportunities
• consulting offers
• new ventures
• job inquiries
• expertise requests
• business deals
• reference requests
• getting back in touch