Peter C Salmon

Current

• Vice President at Salmon Technologies, LLC; Electrostatic Motors & Generators
• Owner at Peter C. Salmon, LLC; Intellectual Property Expert

Past

• CTO at The Salmon Group

Education

• Northeastern University
• Northeastern University
• University of Auckland

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Recommended

2 people have recommended Peter C

Connections

10 connections

Industry

Semiconductors

Websites

• IEEE CNSV

Peter C Salmon’s Summary

Peter is an expert in semiconductor packaging with over 25 patents ranging from new flip chip connectors, to new cooling methods, to new assembly and test methods including solder-free, and next generation packaging for servers and data centers.

Peter is also an experienced systems engineer for both commercial and defense systems.

Peter C Salmon’s Specialties:

flip chip, solder free, assembly automation, wafer level packaging, copper substrates, cooling channels, electrostatics, roll-up display, semiconductors, LCD, systems engineering, system level functional test

Peter C Salmon’s Experience

• Vice President

  Salmon Technologies, LLC; Electrostatic Motors & Generators

  (Electrical/Electronic Manufacturing industry)

  July 2007 — Present (1 year 2 months)

  Salmon Technologies was formed to develop new technology for electrostatic motors and generators. The technology employs a disk architecture with high surface charge achieved using ion-implantation. By operating at 10,000 volts with no magnetic losses, it may provide improved energy efficiency over electro-magnetic motors, as well as a more compact size. The energy density target is 5HP per pound, representing disruptive technology for powering air and ground vehicles.

• Owner

  Peter C. Salmon, LLC; Intellectual Property Expert

  (Privately Held; Myself Only; Semiconductors industry)

  February 2006 — Present (2 years 7 months)

  Peter provides consulting and expert witness services under this LLC. His focus is on Electrical Engineering, Semiconductor Packaging, and Systems Engineering.

• CTO

  The Salmon Group

  (Privately Held; 1-10 employees; Printing industry)

  June 1997 — June 2002 (5 years 1 month)

  Peter led a small group of systems engineers and talented consultants to develop a new form of printing called digital packet printing, using dry toners and electrostatic imaging. This printing method requires no optics in the form of laser beams or photo conductive drums; rather the image is written by direct manipulation of the toner particles. The method worked dramatically well, but the company stumbled with regard to transferring the image to a drum or belt. Peter has written a new patent to overcome this problem.

Peter C Salmon’s Education

• Northeastern University

  EE, Device Physics, Materials Science, 1969 — 1971

• Northeastern University

  MSEE, Electrical Engineering, 1967 — 1970

• University of Auckland

  BE, Electrical Engineering, 1963 — 1966

Additional Information

Peter C Salmon’s Websites:

• IEEE CNSV

Peter C Salmon’s Interests:

Inventions, systems engineering, electronic packaging, servers and data centers, electrostatic motors and generators, photography, hiking

Peter C Salmon’s Groups:

IEEE CNSV, IEEE Consultant's Network of Silicon Valley
Meptec, Microelectronic Packaging and Test Engineering Council
IEEE CPMT, Component Packaging and Manufacturing Technology chapter
Round Table Group, Expert Witness group
SVEWG, Silicon Valley Expert Witness group
National Expert Witness Network
Inventor's Alliance

•    IEEE Consultants' Network of Silicon Valley

Peter C Salmon’s Honors:

Best of Conference Award, for paper delivered to the 2nd International Wafer Level Packaging Conference, San Jose, California, November, 2005.

Peter C Salmon’s Contact Settings

Interested In:

• consulting offers
• new ventures
• expertise requests
• business deals
• reference requests
• getting back in touch