Principal Analyst at EJL Wireless Research
- San Jose, California (San Francisco Bay Area)
- Consumer Electronics
Cary Snyder's Overview
- Principal Analyst at EJL Wireless Research
- Senior Member of Technical Staff at m.2Lab.info
- Test Development/Sr Staff Engineer at Embedded Resource Group, Inc.
- Consulting Engineer at FG2
- Social Network Creator and Student/Veteran Volunteer at Lower Columbia College
- Interface Compliance Test Manager and Senior Consultant at Testronic Laboratories
- Embedded IP Product Specialist at Mentor Graphics Corp. / Embedded System Division
- Computer Industry Standards and Compliance Engineering at VTM, Inc.
- Semiconductor Industry Analyst Consultant at SemiView Inc.
- Senior Analyst, Editor, and Consultant at MDR/Microprocessor Report
- Senior Engineer, IP Cores at Altera
- Co-Founder, Engineering & Product Marketing at Newbus Corp
- Applications Engineering at Virtual Chips, merged w/Phoenix Tech
- Project Manager and Test Engineer at Xilinx
- Hardware and Project Engineering Manager at CHI Systems, Inc.
- Special Products Development Manager at MTI
- Chipset Applications Engineer at LSI Logic (Headland Technology)
- I/O Controller Design Engineer at Spectra Logic
- SSgt at USAF
Cary Snyder's Summary
Accomplished Technical Analyst and System Engineer who is familiar with Consumer, Automotive, Computer, Communication Systems and broad application of digital and RF technology. Blend of hands-on & in-depth analysis skills & capabilities.
KEY Subject Mater Expertise:
• Broad-based hands-on expertise in high-speed and wireless interface systems, to include SOC/digital and RF SME.
>o WiFi, LTE, Microwave
• Recognized for technical excellence from customers/ internal team members; including Delphi (automotive), STM (automotive group), Broadcom (wireless), Microsoft (systems), Sony, TI, AMD+.
>o Projects: bench & system stress testing of SoC-based processing platforms to HS & SS USB, PCIe/SATA, & various memory interfaces.
>o End products; Apple, Microsoft, & mobile products to include automotive infotainment
>o Tests Electrical Si; power subsystem & I/F validation, stress tests, HCK/WHQL or MFi testing.
>o Architectural analysis CPU/DSP architectures; ARM, x86, PPC, Tensilica, CEVA, etc.
>o USB (2/3.x): LS/FS, HS, SS/SS+ (5/10 Gb/s), or HSIC & SSIC etc.
>o PCIe; 2.5, 5, 8, x1 to x16
• Hands-on PC, Tablet, ASIC, SoC/Subsystem integration;
>o PVT characterization; board-, chip-, and subsystems
>o Forced stress tests reveals intermittent faults, to discover and isolation root-cause on PCIe, USB, DDR, SATA, & other I/F
>o x86 ULT/ ARM platforms (new Core M aka Haswell/Broadwell MCM, +new SW: OSX/Win OS, drivers, BIOS/FW & PM
>o Fault-tolerant and redundant system SME
>o SoC-based PM Ultrabooks, MBA/iPad/Tablets test
>o Hands-on test/debug/validation of m/PCIe, USB etc.
• Platform ASIC/SoC test development & integration projects:
>o Mobile power distribution/delivery subsystems; PM +PVT & ultra-low current optimization
>o Testing of Mini-PCIe/M.2 Wireless (USB/PCIe) & SSD subsystems
>o M.2 dev of test & Optimization processes; function, power, performance (FPP) optimization:
>o FPGA & ASIC bring-up, debug, and stress testing; i.e., Tablets, XBox One & SoC PVT
Cary Snyder's Experience
Privately Held; Myself Only; Market Research industry
July 2014 – Present (4 months) San Francisco Bay Area
Duties will apply broad-based Semiconductor and RF Wireless background to include hands-on development and test experience to existing and new EJL Wireless Research topics.
Technical and business analyst duties included research, consulting, and writing reports on high-performance wireless platforms and interfaces between "digital and RF" domains. Will apply past experience with embedded processing chips, FPGA technology, system-on-chip (SoC/SOC) system and subsystems, soft-core or HW/SW IP (Intellectual Property), to include wireless/microwave telecommunication installation and maintenance roles.
Test Development/Sr Staff Engineer
June 2012 – December 2013 (1 year 7 months) Silicon Valley
Social Network Creator and Student/Veteran Volunteer
November 2008 – October 2010 (2 years) Longview, Washington Area
Embedded IP Product Specialist
May 2006 – May 2008 (2 years 1 month)
Senior Engineer, IP Cores
May 1999 – July 2000 (1 year 3 months)
Project Manager and Test Engineer
November 1994 – October 1995 (1 year)
I/O Controller Design Engineer
September 1983 – April 1987 (3 years 8 months)
1975 – 1982 (7 years)
Cary Snyder's Projects
- July 2013 to Present
An essential but still evolving development process involving SW and OS code and drivers, host and device HW, FW, and new test equipment configurations.
Cary Snyder's Publications
- Microprocessor Report - www.linleygroup.com/mpr/2001.php
- February 26, 2001
Cited in 52 patents, and referenced in >100 related articles. Non-Patent Publication Citation listed as "Cary D. Snyder and Max Baron; "Xilinx's A-to-Z System Platform"; Cahners Microprocessor Report, 2001 MICROPROCESSOR REPORT; Article | VOL 15, ISSU 147; pages 8-12 •ISSN: 0899-9341"
Authors: Cary Snyder, Murry Disman
- February 5, 2005
Structured ASICs (SAs) are a new class of semiconductor device fitting in-between FPGA
and cell-based integrated circuits in cost, performance, and function. By virtue of offering
fast development times and significantly lower costs over standard sell ASICs, SAs have
become an important part of the Application Adaptable Integrated Circuit (AAIC) landscape.
This report focuses on the major technical and business trends that are most important to
the SA market. Forecasts for this segment on SA technology can vary widely by what
definition is used for inclusion or exclusion in the SA arena. Further segmentation of the SA
market is likely to occur as simple and complex SoCs are created from the same basic
technology and meet the basic definition of an SA.
Authors: Cary Snyder
- Microprocessor Report - The Linley Group
- December 17, 2013
The recent Microsoft Surface Pro 3 product family announcement solidifies the role Intel's Haswell ULT and ULx86 will play in the tablet computing market or what Intel calls a new category of 2-in-1 PCs. The conversion of an ordinary laptop into a tablet simply by detaching (or attaching) the keyboard is important to the enterprise and business user.
The Haswell mobile U- and Y-processors highlighted in this article are branded as the Intel Core i3, i5, and i7 4th generation of processors are in fact the 1st Generation of a new class of ultra-mobile single MCM (multi-chip module) based on a 22nm processor die being packaged with a special 32nm Lynx Point die. The ultra low-power MCM incorporates special analog components in its substrate in support of Intel's revolutionary Fully-Integrated Voltage Regulator or FIVR power supply and power distribution technology capable of supporting TDP as low as 11.5 watts, with its Core i5-4302Y spec'd with a 4.5 watt SDP (scenario design power) that would be ideal for an 'enterprise-capable' Surface Pro 3 tablet computer.
Microsoft's use of Haswell "D-stepping" silicon is likely to be a significant contributing factor to its claim of 30% less power consumption than Surface Pro 2 models may have earlier silicon versions of Haswell ULT or ULx86 processors.
This gives great promise to the high-end tablet computer market in 2014 as Intel ships its 2nd generation Broadwell-based ULx86-based processors and Microsoft, Apple, and other companies ship next generation tablet, Ultrabook, MacBook Air, and 2-in-1 convertible notebook PCs by year's end. While I find lower cost tablet products based on Atom and ARM-based platform processors interesting, a fully business- or enterprise-capable tablet PC with extended battery life creates a compelling reason to buy one as my next PC that I can take and use anywhere I go!
Authors: Cary Snyder
- July 3, 2006
An older published article with content that is surprisingly relevant to SOC or Platform IP Integration in 2014! Despite USB’s commodity type support from the USB IF, it almost fifteen-year existence, and almost universal end-user acceptance, adding USB functionality to a platform processor can be a daunting design task.
Many experienced design teams have underestimated the complexity of USB interactions on a platform with agreesive power managagement in regards to power up and power down complexities only to pay the price after seeing their entire project grind to a screeching halt
Cary Snyder's Volunteer Experience & Causes
Cary Snyder's Languages
Cary Snyder's Skills & Expertise
- Embedded Systems
- Hardware Testing
- Physical Verification
- Engineering Support
- Board Bring-up
- Functional Specifications
- Product Marketing
- High Performance Computing
- Integrated Circuit Design
- Device Characterization
- Power Analysis
- Device Drivers
- Customer Support
- Hardware Architecture
- Software Documentation
- Low-power Design
- PCB design
- Mixed Signal
- Hardware Verification
- Spec Writing
- Technology Enablement
- High Performance Systems
- Mobile Platforms
Cary Snyder's Additional Information
Cary is most interested in the use and proliferation of social media for professional, personal, and public service use. ~ Sharing his skills and life's work by getting involved with and promoting community involvement, both online and where we live, ~ but most of all finding a way to share life experiences with our next generation, be it family, in the community, or where ever else there is need.
- Groups and Associations:
Anything involving USB, various entrepreneurial groups on LinkedIn, groups involved with current and future FPGAs, Professional & Business use of Social Media
Contact Cary for:
- career opportunities
- consulting offers
- new ventures
- job inquiries
- expertise requests
- business deals
- reference requests
- getting back in touch