Cary Snyder

Cary Snyder

Principal Analyst at EJL Wireless Research

San Jose, California (San Francisco Bay Area)
Consumer Electronics

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Cary Snyder's Overview

  • Social Network Creator and Student/Veteran Volunteer at Lower Columbia College
  • Interface Compliance Test Manager and Senior Consultant at Testronic Laboratories
  • Embedded IP Product Specialist at Mentor Graphics Corp. / Embedded System Division
  • Computer Industry Standards and Compliance Engineering at VTM, Inc.
  • Semiconductor Industry Analyst Consultant at SemiView Inc.
  • Senior Analyst, Editor, and Consultant at MDR/Microprocessor Report
  • Senior Engineer, IP Cores at Altera
  • Co-Founder, Engineering & Product Marketing at Newbus Corp
  • Applications Engineering at Virtual Chips, merged w/Phoenix Tech
  • Project Manager and Test Engineer at Xilinx
  • Hardware and Project Engineering Manager at CHI Systems, Inc.
  • Special Products Development Manager at MTI
  • Chipset Applications Engineer at LSI Logic (Headland Technology)
  • I/O Controller Design Engineer at Spectra Logic
  • SSgt at USAF

500+ connections


Cary Snyder's Summary

Accomplished Technical Analyst and System Engineer who is familiar with Consumer, Automotive, Computer, Communication Systems and broad application of digital and RF technology. Blend of hands-on & in-depth analysis skills & capabilities.

KEY Subject Mater Expertise:
• Broad-based hands-on expertise in high-speed and wireless interface systems, to include SOC/digital and RF SME.
>o WiFi, LTE, Microwave
• Recognized for technical excellence from customers/ internal team members; including Delphi (automotive), STM (automotive group), Broadcom (wireless), Microsoft (systems), Sony, TI, AMD+.
>o Projects: bench & system stress testing of SoC-based processing platforms to HS & SS USB, PCIe/SATA, & various memory interfaces.
>o End products; Apple, Microsoft, & mobile products to include automotive infotainment
>o Tests Electrical Si; power subsystem & I/F validation, stress tests, HCK/WHQL or MFi testing.
>o Architectural analysis CPU/DSP architectures; ARM, x86, PPC, Tensilica, CEVA, etc.
>o USB (2/3.x): LS/FS, HS, SS/SS+ (5/10 Gb/s), or HSIC & SSIC etc.
>o PCIe; 2.5, 5, 8, x1 to x16
• Hands-on PC, Tablet, ASIC, SoC/Subsystem integration;
>o PVT characterization; board-, chip-, and subsystems
>o Forced stress tests reveals intermittent faults, to discover and isolation root-cause on PCIe, USB, DDR, SATA, & other I/F
>o x86 ULT/ ARM platforms (new Core M aka Haswell/Broadwell MCM, +new SW: OSX/Win OS, drivers, BIOS/FW & PM
>o Fault-tolerant and redundant system SME
>o SoC-based PM Ultrabooks, MBA/iPad/Tablets test
>o Hands-on test/debug/validation of m/PCIe, USB etc.
• Platform ASIC/SoC test development & integration projects:
>o Mobile power distribution/delivery subsystems; PM +PVT & ultra-low current optimization
>o Testing of Mini-PCIe/M.2 Wireless (USB/PCIe) & SSD subsystems
>o M.2 dev of test & Optimization processes; function, power, performance (FPP) optimization:
>o FPGA & ASIC bring-up, debug, and stress testing; i.e., Tablets, XBox One & SoC PVT

Cary Snyder's Experience

Principal Analyst

EJL Wireless Research

Privately Held; Myself Only; Market Research industry

July 2014Present (4 months) San Francisco Bay Area

Duties will apply broad-based Semiconductor and RF Wireless background to include hands-on development and test experience to existing and new EJL Wireless Research topics.

Technical and business analyst duties included research, consulting, and writing reports on high-performance wireless platforms and interfaces between "digital and RF" domains. Will apply past experience with embedded processing chips, FPGA technology, system-on-chip (SoC/SOC) system and subsystems, soft-core or HW/SW IP (Intellectual Property), to include wireless/microwave telecommunication installation and maintenance roles.

Senior Member of Technical Staff

October 2013June 2014 (9 months) San Francisco Bay Area

Test Development/Sr Staff Engineer

Embedded Resource Group, Inc.

June 2012December 2013 (1 year 7 months) Silicon Valley

Consulting Engineer


November 2010June 2012 (1 year 8 months) San Jose, CA

Social Network Creator and Student/Veteran Volunteer

Lower Columbia College

November 2008October 2010 (2 years) Longview, Washington Area

Interface Compliance Test Manager and Senior Consultant

Testronic Laboratories

June 2008October 2008 (5 months) USA Pacific Northwest

Embedded IP Product Specialist

Mentor Graphics Corp. / Embedded System Division

May 2006May 2008 (2 years 1 month)

Computer Industry Standards and Compliance Engineering

VTM, Inc.

August 2005April 2006 (9 months) Portland, Oregon Area

Semiconductor Industry Analyst Consultant

SemiView Inc.

July 2002August 2004 (2 years 2 months) San Francisco Bay Area

Senior Analyst, Editor, and Consultant

MDR/Microprocessor Report

July 2000August 2002 (2 years 2 months) San Francisco Bay Area

Senior Engineer, IP Cores


May 1999July 2000 (1 year 3 months)

Co-Founder, Engineering & Product Marketing

Newbus Corp

January 1993December 1998 (6 years) San Francisco Bay Area

Applications Engineering

Virtual Chips, merged w/Phoenix Tech

November 1995December 1997 (2 years 2 months)

Project Manager and Test Engineer


November 1994October 1995 (1 year)

Hardware and Project Engineering Manager

CHI Systems, Inc.

February 1994November 1994 (10 months)

Special Products Development Manager


November 1990January 1994 (3 years 3 months)

Chipset Applications Engineer

LSI Logic (Headland Technology)

October 1988June 1990 (1 year 9 months)

I/O Controller Design Engineer

Spectra Logic

September 1983April 1987 (3 years 8 months)



19751982 (7 years)

Cary Snyder's Projects

  • Function, Power, Performance (FPP) Power Optimization on M.2 & Mini-PCIe

    • July 2013 to Present

    An essential but still evolving development process involving SW and OS code and drivers, host and device HW, FW, and new test equipment configurations.

Cary Snyder's Publications

  • Xilinx's A-to-Z System Platform

    • Microprocessor Report -
    • February 26, 2001

    Cited in 52 patents, and referenced in >100 related articles. Non-Patent Publication Citation listed as "Cary D. Snyder and Max Baron; "Xilinx's A-to-Z System Platform"; Cahners Microprocessor Report, 2001 MICROPROCESSOR REPORT; Article | VOL 15, ISSU 147; pages 8-12 •ISSN: 0899-9341"

  • Structured ASICs Offer Applications Adaptability

    • Semiview
    • February 5, 2005
    Authors: Cary Snyder, Murry Disman

    Structured ASICs (SAs) are a new class of semiconductor device fitting in-between FPGA
    and cell-based integrated circuits in cost, performance, and function. By virtue of offering
    fast development times and significantly lower costs over standard sell ASICs, SAs have
    become an important part of the Application Adaptable Integrated Circuit (AAIC) landscape.

    This report focuses on the major technical and business trends that are most important to
    the SA market. Forecasts for this segment on SA technology can vary widely by what
    definition is used for inclusion or exclusion in the SA arena. Further segmentation of the SA
    market is likely to occur as simple and complex SoCs are created from the same basic
    technology and meet the basic definition of an SA.

  • Haswell ULT Integrates PC Platform

    • Microprocessor Report - The Linley Group
    • December 17, 2013
    Authors: Cary Snyder

    The recent Microsoft Surface Pro 3 product family announcement solidifies the role Intel's Haswell ULT and ULx86 will play in the tablet computing market or what Intel calls a new category of 2-in-1 PCs. The conversion of an ordinary laptop into a tablet simply by detaching (or attaching) the keyboard is important to the enterprise and business user.

    The Haswell mobile U- and Y-processors highlighted in this article are branded as the Intel Core i3, i5, and i7 4th generation of processors are in fact the 1st Generation of a new class of ultra-mobile single MCM (multi-chip module) based on a 22nm processor die being packaged with a special 32nm Lynx Point die. The ultra low-power MCM incorporates special analog components in its substrate in support of Intel's revolutionary Fully-Integrated Voltage Regulator or FIVR power supply and power distribution technology capable of supporting TDP as low as 11.5 watts, with its Core i5-4302Y spec'd with a 4.5 watt SDP (scenario design power) that would be ideal for an 'enterprise-capable' Surface Pro 3 tablet computer.

    Microsoft's use of Haswell "D-stepping" silicon is likely to be a significant contributing factor to its claim of 30% less power consumption than Surface Pro 2 models may have earlier silicon versions of Haswell ULT or ULx86 processors.

    This gives great promise to the high-end tablet computer market in 2014 as Intel ships its 2nd generation Broadwell-based ULx86-based processors and Microsoft, Apple, and other companies ship next generation tablet, Ultrabook, MacBook Air, and 2-in-1 convertible notebook PCs by year's end. While I find lower cost tablet products based on Atom and ARM-based platform processors interesting, a fully business- or enterprise-capable tablet PC with extended battery life creates a compelling reason to buy one as my next PC that I can take and use anywhere I go!

  • Avoiding Common Mistakes When Integrating IP Into Your SOC

    • SOCcentral
    • July 3, 2006
    Authors: Cary Snyder

    An older published article with content that is surprisingly relevant to SOC or Platform IP Integration in 2014! Despite USB’s commodity type support from the USB IF, it almost fifteen-year existence, and almost universal end-user acceptance, adding USB functionality to a platform processor can be a daunting design task.

    Many experienced design teams have underestimated the complexity of USB interactions on a platform with agreesive power managagement in regards to power up and power down complexities only to pay the price after seeing their entire project grind to a screeching halt

Cary Snyder's Volunteer Experience & Causes

  • Volunteer Experience

    • Web/Technology Instructor

      Kelso/Longview VFW Post
  • Volunteer Interests

    • Causes I care about:

      • Economic Empowerment
      • Science and Technology

Cary Snyder's Languages

  • German

Cary Snyder's Skills & Expertise

  1. ASIC
  2. USB
  3. Embedded Systems
  4. PCIe
  5. Hardware
  6. Debugging
  7. Hardware Testing
  8. Physical Verification
  9. PCI-X
  10. Engineering Support
  11. Board Bring-up
  12. Multi-core
  13. Functional Specifications
  14. Product Marketing
  15. Processors
  16. High Performance Computing
  17. Electronics
  18. FPGA
  19. Integrated Circuit Design
  20. Device Characterization
  21. Power Analysis
  22. Firmware
  23. Microprocessors
  24. Device Drivers
  25. SoC
  26. Customer Support
  27. Hardware Architecture
  28. VLSI
  29. Software Documentation
  30. Low-power Design
  31. Verilog
  32. SERDES
  33. PCB design
  34. Linux
  35. Wireless
  36. WiFi
  37. SATA
  38. Testing
  39. EDA
  40. IC
  41. Analog
  42. Simulations
  43. ARM
  44. X86
  45. Mixed Signal
  46. Hardware Verification
  47. Spec Writing
  48. Technology Enablement
  49. High Performance Systems
  50. Mobile Platforms

View All (50) Skills View Fewer Skills

Cary Snyder's Additional Information


Cary is most interested in the use and proliferation of social media for professional, personal, and public service use. ~ Sharing his skills and life's work by getting involved with and promoting community involvement, both online and where we live, ~ but most of all finding a way to share life experiences with our next generation, be it family, in the community, or where ever else there is need.

Groups and Associations:

Anything involving USB, various entrepreneurial groups on LinkedIn, groups involved with current and future FPGAs, Professional & Business use of Social Media

Contact Cary for:

  • career opportunities
  • consulting offers
  • new ventures
  • job inquiries
  • expertise requests
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  • reference requests
  • getting back in touch

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