
Director, Procurement Engineering, Global Procurement at Flextronics (babhui@yahoo.com) TopLinked.com [LION] 7500+ 13M+
China

Director, Procurement Engineering, Global Procurement at Flextronics (babhui@yahoo.com) TopLinked.com [LION] 7500+ 13M+
China
More than 14 years’ experience in the electronics (OEM, CEM/EMS, ODM) manufacturing/chemicals industry in Singapore & China, among which over 10 years were in various managerial positions.
Experienced in sourcing activities for cost reduction through supply localization, value engineering and supplier development program;
In-depth knowledge on chemicals for electronic applications; advanced printed circuit board (PCB) manufacturing and assembly/packaging technology; other electronic components (actives, passives, connectors, etc).
My goals are to gain even greater exposure & experience in managing cross-cultural diversities, and to strike a delicate balance between my technical and business aspirations to reach a newer height.
My philosophy: "To Be Or Not To Be, That's The Question...事在人为"
My motto: "The Best Is Yet To Be... 没有最好, 只有更好!"
Values that I care:
Leadership 领导能力
Efficiency & Effectiveness 效率/效益
Enthusiasm 热忱
Broadband 宽频
Attitude 态度
Best-in-Class 追求顶级
Humility 谦逊
Urgency 紧急意识
Initiative 自发性
• Technical Program Management
• Analytical Laboratory
• R&D
• MPCpS (Machine/Process Capability Study) Methodology
• Quality Management
• Environmental Compliance (RoHS/WEEE/EuP), Lead-Free Technology
• Six Sigma/Lean Manufacturing
• Sales & Marketing
• Process Engineering
• Component/Procurement Engineering
• Value Analysis/Value Engineering (VA/VE)
• Commodity Coding
• Spend Data Management (SDM)
• Cost Reduction/Avoidance
• Supplier Development Process (SDP)
(Public Company; 10,001 or more employees; FLEX; Electrical/Electronic Manufacturing industry)
January 2008 — Present (7 months)
- Identify opportunities for redesign or component substitution to provide cost reduction or quality improvement.
- Assist GCM & SSCM in identifying opportunities to source with Flextronics strategic suppliers during & after the customer design process.
- Provide technical back-up for alternate sourcing recommendations, such as identifying relevant spec differences, and providing the interface with the customer’s design team.
- Assign commodity codes and classify spend data to improve spend visibility & leverage for GCM to negotiate with suppliers.
- Help maximize the purchasing power through component consolidation, where possible.
- Provide technical support to Flextronics segments as needed to resolve manufacturing problems related to component performance, or customer AVL issues.
- Gather and evaluate supplier road maps together with commodity managers.
(Public Company; 10,001 or more employees; FLEX; Electrical/Electronic Manufacturing industry)
April 2006 — December 2007 (1 year 9 months)
• Responsible for global component engineering under Sourcing, Global Procurement, to support Flextronics design centres on ODM projects.
• Standardize corporate AVL/AML management control and approval process (through centralized component database) to promote design re-use.
• Mitigate risks associated with supply chain, technology, quality & reliability and environmental compliance (RoHS/WEEE/EuP/etc.) through preferred supplier ranking system.
• Define component reliability requirements & specifications for different product applications & market segments
• Early engagement in Value Analysis/Value Engineering activities with design centers for identifying cost reduction opportunities
• Technical audit on supplier qualification & development activities with Global Commodity Management team.
• Develop suppliers of tomorrow that can offer speed, cost, technology and quality to ODM business through global SDP (Supplier Development Process)
(Public Company; 10,001 or more employees; FLEX; Electrical/Electronic Manufacturing industry)
April 2005 — March 2006 (1 year)
• Regional component engineering & RoHS North Asia lead in China, covering Flextronic manufacturing sites at Doumen (Zhuhai), Xixiang (Shenzhen), Dongguan, Shanghai, Changzhou, Nanjing, etc., and design centres at Guangzhou, Shanghai, Shenzhen, etc.
(Public Company; 10,001 or more employees; FLEX; Electrical/Electronic Manufacturing industry)
June 2004 — March 2005 (10 months)
• Flextronics Doumen campus component engineering lead
• Flextronics Doumen campus RoHS implementation champion
(Public Company; 1001-5000 employees; Electrical/Electronic Manufacturing industry)
August 2001 — May 2004 (2 years 10 months)
• Responsible for driving yield improvement activities, reducing customer returns & building total customer satisfaction
• Responsible for implementing company wide quality system, internal audit & work closely with customers for plant visits/audits
• Worked closely with customers (both CEMs & OEMs such as Flextronics, Solectron, Celestica, Jabil, Venture, Motorola, HP, IBM, Dell, Cisco, Lucent, NEC, etc.) in resolving technical or quality issues.
• Responsible for yield improvement, cycle time reduction, cost reduction & process troubleshooting, process/capability improvement, new process/ product introduction, capital budgeting & capacity planning.
• Implemented new processes (such as reverse pulse copper plating, liquid photoimaging technology, etc.) into mass production for capability improvement & cost reduction efforts
• Researched new projects in alignment with corporate roadmap & new capabilities
(Public Company; 1001-5000 employees; Chemicals industry)
July 1998 — June 2001 (3 years)
• Sales and technical support to regional PCB customer base.
• Responsible for new technology transfer, and working closely with customers, suppliers and scientific organizations.
• Responsible for customer service and internal QA laboratory.
• Regional technical support, including new technology transfer.
• Responsible for customer service and internal QA laboratory.
• Responsible for both internal & external technical training or presentation
(Public Company; 10,001 or more employees; MOT; Electrical/Electronic Manufacturing industry)
May 1994 — June 1998 (4 years 2 months)
• Managed and led technical programs in developing advanced BGA substrates; including design, manufacturability, and capabilities.
• Worked closely with customers, suppliers, and scientific organizations worldwide in developing new BGA substrate technologies.
• Responsible for new substrate and PCB process technology development and qualification.
• Responsible for failure analysis in solving process issues.
• Start-up of several production lines for new PCB facility.
• Provide engineering leadership and support to manufacturing operations so as to achieve operational objectives of quality, cycle time, and productivity.
MSc, Management of Technology, 1999 — 2001
Major in:
- Management of Technology
- Management of Research & Development
- Negotiation & Coonflict Resolution Skills
- Accounting
- People & Organization
- Quality Management
- Operations Management
- Managing Technical Professionals
- Business Management (ASEAN Business)
- Managerial Economics
MSc, Industrial & Systems Engineering, 1997 — 1999
Major in:
- Systems Approach to Project Management
- Cost Analysis & Engineering Economy
- Engineering Probability & Simulation
- Statistical Quality Control
- Advanced Engineering Statistics
- Operations Planning & Control
- Decision Analysis
- New Product Management
- Material Flow Systems
- Quality Planning & Management
BEng, Chemical Engineering, 1990 — 1994
Major in:
- Mathematics
- Computing
- Graphics
- Economics
- Engineering I & II
- General & Physical Chemistry
- Engineering Materials
- Chemical Engineering Thermodynamics
- Fluid Mechanics
- Heat & Mass Transfer
- Organic Chemistry & Biochemistry
- Chemical Engineering Principles
- Strength of Materials
- Financial Accounting
- Applied Mathematics
- Reactor Systems I & II
- Process Instrumentation & Control
- Solid & Fluid-Solid Systems
- Separation Processes I & II
- Process Heat Transfer/Materials of Construction
- Sociology
- Process Dynamics & Control
- Industrial Systems & Plant Safety
- Petroleum Refining
- Process Systems Engineering
- Distributed Process Control System
- Pretrochemicals & Processing Technology
- Management & Law
GCE "A" Level, Biology, Chemistry, Physics, Maths, 1988 — 1989
GCE "O" Level, Science, 1984 — 1987
Best Award in Chinese subject - 1986, 1987
First runner-up in nation-wide Chinese essay competition (Senior Citizen Week) - 1987
Primary 6, 1978 — 1983
Class Monitor and Head Prefect (1983)
Maths competition district and overall champion in Sarawak (1983)
Chinese martial arts, yoga, hiking/camping, roller-blading, swimming, net-surfing, reading, music, travel
Member of following professional bodies:
• Institute of Supply Management (ISM), Hong Kong
• Supply Chain ASIA
• PRD (Pearl River Delata) SCM Club, South China
• IMAPS International Microelectronics and Packaging Society
• Surface Mount Technology Association (SMTA)
• American Electroplaters and Surface Finishers Society (AESF)
• The Institution of Chemical Engineers (IChem)
• Singapore Surface Finishing Society (SSFS)
• IPC – Association Connecting Electronics Industries
Adviser, company outdoor adventure club (2003~2004);
Chairman, company outdoor adventure club (2006~now)