Andrew Farris

Andrew Farris

Research Scientist at Lockheed Martin Aeronautics

Greater Los Angeles Area

Current
Past
Education
  • California Polytechnic State University-San Luis Obispo
  • California Polytechnic State University-San Luis Obispo
Connections
27 connections
Industry
Defense & Space
Websites

Andrew Farris’s Summary

Electronics and computer engineer, antenna design, digital design, VLSI, embedded systems, computer architecture design and simulation, digital signal processing, software.

Andrew Farris’s Specialties:

Experienced with powerful industry tools, (FEKO, HFSS, CST Studio, Catia 5, SPICE, Cadence Allegro, Matlab, Minitab, Electric, MS Office, Visual Studio), digital logic design approaches and tradeoffs, programming, low-level debugging and scripting, multiple languages (C/C++, Java, assembly, Fortran, bash, PHP, Python, and MySQL). Web application developer. Linux tools, systems administration, open-source community interaction, UI debugging, bug reporting, user support and training.


Andrew Farris’s Experience

  • Research Scientist

    Lockheed Martin Aeronautics

    (Public Company; LMT; Defense & Space industry)

    January 2009Present (11 months)

    ADP Electromagnetics Division, Skunk Works

  • Graduate Student

    Cal Poly State University

    (Educational Institution; 1001-5000 employees; Higher Education industry)

    September 2006June 2008 (1 year 10 months)

    Graduate study in Electrical Engineering, research in electronics drop impact reliability

  • Applications Engineer Intern

    Henkel Corporation

    (Public Company; Consumer Goods industry)

    July 2007September 2007 (3 months)

    Lead-free solder reliability research done in partnership between Henkel Electronics, Flextronics International, and Cal Poly SLO.

  • Web Applications Programmer

    MediaStorm.la

    (Internet industry)

    December 2003May 2007 (3 years 6 months)

    Developed website back-ends for MySQL database, xhtml and xml data, debugging
    Secure handling of sensitive user data, financial transaction processing, forms processing


Andrew Farris’s Education

  • California Polytechnic State University-San Luis Obispo

    Masters , Electrical Engineering , 20062008

    Graduate study in Electrical Engineering. Focus of study in the areas of digital design, embedded systems, and computer architecture. Thesis research work in lead-free solder reliability, drop impact testing, high-speed data acquisition systems, board-level electronics failure analysis, underfill application for drop impact reliability.

    Activities and Societies:
    IEEE, IMAPS, SMTA, Cal Poly Linux Users Group (CPLUG), member of student chapters
  • California Polytechnic State University-San Luis Obispo

    Bachelor of Science , Computer Engineering , 20022006

    Worked on a portion of the Cal Poly CiNIC advanced integrated smart network card project, testing an embedded system incorporating multiple FPGAs and hardware interfaces.

    Activities and Societies:
    IEEE, IMAPS, SMTA, Cal Poly Linux Users Group (CPLUG), member of student chapters

Additional Information

Andrew Farris’s Websites:

Andrew Farris’s Interests:

Digital Design, VLSI, Mixed Signal and RF Circuits, Programmable Logic, Computer Architecture, Hardware, Mobile and Low Power Computing, Linux, Embedded Systems, Electromagnetic Radiation, Antennas, and Communications Hardware

Andrew Farris’s Groups:

IEEE, IMAPS, SMTA, Cal Poly Linux Users Group (CPLUG)

  •    The Official IEEE Group
  •    California Polytechnic State University Alumni
  •    International Microelectronics and Packaging Society (IMAPS)
  •    Cal Poly Alumni SLO
  •    California Polytechnic University San Luis Obispo Alumni
  •    Cal Poly Alumni Association
  •    IEEE Antennas and Propagation Society Members
  •    Southern California Electronics

Andrew Farris’s Honors:

Received grant from the San Jose Chapter of SMTA in 2008 for lasting contribution to drop impact reliability of lead-free solder and chip scale packages.

Publications:
"Drop Impact Reliability of Edge-bonded Lead-free Chip Scale Packages", Microelectronics Reliability, Vol. 49, No. 7, 2009, pp. 761-770.

“Drop test reliability of lead-free chip scale packages”, Proc. of 2008 IEEE ECTC, pp. 1173-1180.

“Drop impact dynamic response study of JEDEC JESD22-B111 test board”, Proceedings of the 41th International Symposium on Microelectronics (IMAPS’2008), Providence, RI, USA, Nov. 1 – 6, 2008.

“Board Level Failure Analysis of Chip Scale Package Drop Test Assemblies”, Proceedings of the 41th International Symposium on Microelectronics (IMAPS’2008), Providence, RI, USA, Nov. 1 – 6, 2008.


Andrew Farris’s Contact Settings

Interested In:

  • career opportunities
  • new ventures
  • reference requests
  • getting back in touch

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