Endicott Interconnect Technologies, Inc.

Endicott Interconnect Technologies, Inc. (EI) is a world class supplier of electronic interconnect solutions and electro/mechanical equipment. As a successor to IBM’s microelectronics division in Endicott, NY, we have over 45 years of experience in providing microelectronics solutions and we bring to market a unique mix of leading edge technology and technical know-how to provide customers with a time-to-market advantage.

Effective vertical integration differentiates us from any supplier in the electronic packaging industry. We are expert in the fabrication and assembly of complex printed circuit boards, advanced flip chip and wire bond semiconductor packaging and precision equipment manufacturing and integration. We also provide services that complement these offerings; design and layout, thermal, electrical and mechanical modeling, reliability and environmental testing and physical analysis. Our solutions deliver leading edge technology and best-in-class quality, performance and reliability and are available at any stage of the product life cycle. While uncommon, this offers our clients perfect and seamless extendibility from prototype, preproduction and production phases without the headache of shifting facilities, processes and support personnel.

EI product lines support the needs of the defense & aerospace, communications & computing, semiconductor, advanced test equipment, and medical markets where highly reliable products built in robust manufacturing operations are critical to success.

Specialties

advanced electronic packaging solutions, printed circuit board fabrication, semiconductor packaging and assembly services.