Alchimer provides nanometric films for a variety of microelectronic and MEMS applications, including through-silicon vias (TSVs) for 3D packaging and wafer-level interconnects.
Our wet deposition technology helps our customers make electronic devices with greater performance and functionality and at much lower cost, while also delivering superior film quality and faster time to market.
The Alchimer suite of products offers a combination of conformality, step coverage and purity that cannot be matched by PVD, CVD, or other dry processes, with costs 40 to 70 percent lower than standard dry processes.
For example, the company’s AquiVia TSV barrier-layer process can provide uniform, guaranteed 100 percent step coverage over complex silicon topography, including high-aspect-ratio vias with scalloped walls. This means that subsequent depositions can be done in significantly less time and at lower cost.
Beyond TSVs, our products offer significant performance and cost opportunities in several of today’s most strategic market sectors, such as dual damascene on-chip interconnects, solar PV conductive layers, solid-state lighting, and advanced substrates.
Alchimer’s Electrografting (eG™) and Chemicalgrafting (cG™) processes are easily implemented on a variety of hardware platforms. The company also is developing a new modular platform that delivers production-worthy implementation of both eG and cG processes with very low capital cost.
For more details, visit www.alchimer.com
