Tessera Technologies, Inc. develops and licenses miniaturization technologies for the electronics industry. It engages in licensing technologies for chip-scale, multi-chip, and wafer-level packaging; and micro-optics solutions for miniaturization in electronic products. The company’s chip packaging technology enables its customers to produce semiconductor chips used in electronics products, including digital audio players, digital cameras, personal computers, personal digital assistants, video game consoles, and mobile phones. It also offers engineering services that include customized product and package design, prototyping and testing, modeling, simulation, failure analysis, and reliability testing and related training services to semiconductor makers and assemblers, system manufacturers, electronic manufacturing service companies, and government agencies and their contractors; and assembly services, such as training and consulting services to assist semiconductor assemblers in designing, implementing, upgrading, and maintaining their chip-scale packaging and wafer level packaging assembly lines. In addition, the company provides infrastructure services, including evaluation, qualification, cost reduction, and cost analysis services to companies that develop and manufacture equipment and materials to support the infrastructure needed to manufacture semiconductors. Further, it offers optics design and manufacturing services, which include custom design, simulation, prototyping, and small-volume manufacturing of wafer optics for communications and semiconductor equipment industries. Tessera offers its technology to the customers primarily in the United States, Asia, and Europe. The company was founded in 1990 and is headquartered in San Jose, California.