Solvision, Inc. engages in the design and manufacture of automated visual inspection equipment for the microelectronics industry. Its products include Nano ES3000, a vision inspection system for singulated flip-chip; Nano CSP2000, a tool for inspection of C4 bumps and chip capacitor pads on CSP strips; Precis 3D, an inspection system for flip-chip and wafer-level package industry; Nano T3D, an automated 3D bump inspection system for flip-chip substrates; and AV 6010, an inspection solution for IC packages and memory card inspection, as well as solutions for OEM and custom applications. The company offers inspection solutions for a variety of application areas in the wafer, substrate packaging, and IC packaging industries. Solvision was founded in 1994 and is headquartered in Boucherville, Canada. As of February 28, 2008, Solvision, Inc. operates as a subsidiary of Zygo Corp. (NasdaqNM:ZIGO).